Introduction of the two most popular new chip pack

2022-08-14
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Introduction to two new chip packaging technologies

Introduction to two new chip packaging technologies

in the process of computer memory products, memory packaging technology is the most critical step in the memory manufacturing process. Memory modules with different packaging technologies have large differences in performance. Only high-quality packaging technology can produce perfect memory products. This paper mainly introduces two new packaging technologies -- BLP and TinyBGA technology

packaging technology its ceramic aluminum new material has been approved, and the special project of Anhui Province to create a major emerging industry is a technology to package integrated circuits. Take our common memory as an example. The volume and appearance we actually see are not the size and appearance of the real memory, but the product of the memory chip after packaging. This packaging is necessary and crucial for chips. Because the chip must be isolated from the outside world to prevent the impurities in the air from corroding the chip circuit and causing the electrical performance to decline. On the other hand, the packaged chip is also easier to install and transport. Because the quality of packaging technology also directly affects the performance of the chip itself and the design and manufacture of PCB (printed circuit board) connected with it, it is also crucial

although there are various packaging technologies commonly used in the industry at present, 90% of them use TSOP technology. TSOP is called thin small outline package in English, which is the representative of the second generation of memory packaging technology that appeared in the 1980s. A typical feature of TSOP is to make pins around the package chip. For example, the IC of SDRAM has pins on both sides, and the IC of SGRAM has pins on all sides. TSOP is suitable for mounting and wiring on PCB with SMT surface mounting technology, with reduced package size and parasitic parameters. It is suitable for high-frequency applications, easy to operate and high reliability. The brands that adopt this technology include Samsung, Hyundai, Kingston, etc. TSOP is widely used in the manufacturing of SDRAM memory at present, but with the passage of time and the progress of technology, TSOP has become increasingly unsuitable for the new generation of high-frequency and high-speed memory

like microprocessors, the technology of memory modules is constantly updated. You may have found that the shape of the particles on the memory module in your hand is gradually changing, becoming smaller and more refined than before. The change is not only on the surface, but also these new chips have made great progress in applicable frequency and electrical characteristics compared with the older generation. This crystallization is attributed to those manufacturers' selection of new memory chip packaging technology. The new chip packaging technology represented by BLP and TinyBGA technology has gradually matured

blp technology is also a commonly used technology in the market at present. The full name of BLP in English is bottom LED plastic (bottom LED plastic packaging technology). The ratio of chip area to package area is greater than 1:1.1, which meets the CSP (chip size package) filling and packaging specification. Not only the height and area are extremely small, but also the electrical characteristics have been further improved, and the manufacturing cost is not high. It is widely used in the manufacturing of new generation memory such as sdramrdramddr. As the price of plastic packaging substrate for key components in BLP packaging continues to decline, BLP packaging memory will soon enter the homes of ordinary users

another important memory chip packaging technology is TinyBGA technology. TinyBGA technology is a patent of KINGMAX and was successfully developed in August 1998. To understand TinyBGA technology, we must first know what BGA is. BGA is the English abbreviation of ball gird array, that is, ball grid array packaging. It is a new generation of chip packaging technology. Its i/o terminals are distributed under the package in the form of circular or cylindrical solder joints in the form of array. The advantage of BGA technology is that it can increase the number and spacing of i/o, and eliminate the production cost and reliability problems caused by high number of i/o. It has been widely used in the packaging field of large-scale integrated circuits in Tangshan area, such as notebook computer memory, motherboard chipset and so on. For example, Intel 845PE and via kt400 chipsets we are familiar with are all products using this packaging technology

tinybga means miniature BGA. The full English name of TinyBGA is tiny ball grid array (small ball grid array packaging). The ratio of chip area to packaging area is not less than 1:1.14, which belongs to a branch of BGA packaging technology. The application of this innovative technology can increase the memory capacity of DRAM in all computers by two to three times under the condition of constant volume. TinyBGA uses BT resin to replace the traditional TSOP technology, which has smaller volume, better heat dissipation performance and electrical performance

tinybga packaging technology has dramatically improved the storage capacity per square inch. 256M memory can be manufactured on the PCB board with the same space as the 144 pin SO-DIMM packaged by 128M TSOP. For two memory modules of the same size, the capacity of TinyBGA packaging is twice that of TSOP, but the price has not changed significantly. The data shows that the memory products with TinyBGA packaging technology are only one third of the size of TSOP packaging with the same capacity; When the process diameter of the memory module is less than 0.25 m, the cost of TinyBGA packaging is less than that of TSOP packaging

the i/o terminals of TinyBGA encapsulated memory are led out from the center of the chip, while TSOP is led out from all around. This effectively shortens the transmission distance of the signal, and the length of the signal transmission line is only one quarter of that of the traditional TSOP technology, so the attenuation of the signal will be reduced. In this way, we insist on creating reassuring products for customers, which not only greatly improves the anti-interference and anti-noise performance of the chip, but also improves the electrical performance. The chip packaged with TinyBGA can resist an external amount of up to 300MHz, while the chip packaged with traditional TSOP can resist an external amount of up to 150MHz. Moreover, the memory packaged with TinyBGA is not only smaller than the TSOP chip with the same capacity, but also thinner (the packaging height is less than 0.8mm), and the effective heat dissipation path from the metal substrate to the radiator is only 0.36mm. As a result, TinyBGA memory has higher heat transfer efficiency, which is very suitable for long-running systems with excellent stability. After repeated tests, the thermal impedance of TinyBGA is 75% lower than that of TSOP. Obviously, compared with the traditional TSOP packaging method, TinyBGA packaging method has a faster and more effective way of heat dissipation

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